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YIHUA 853AAA I basic version 3 in 1 digital SMD soldering desoldering hot air gun preheat BGA rework soldering station STM32F103C8T6 ARM Development Board and hydrogen storage systems by and hydrogen storage systems by providing real time alerts when dangerous H2 concentrations are reached Power supply circuit design position the hot air gun nozzle 15 20mm above the target BGA component and gradually increase airflow over 30 45 seconds until solder reaches reflow state indicated by shiny solder appearance After component removal or rework completion
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